Self-assembling Chips From IBM

Using nature as a model, IBM has created a method of manufacturing microchips using a self-assembling substance and vacuum insulation to create enough tiny gaps to allow a flow of electricity without a corresponding loss in power or efficiency.

The key is a special polymer that is used to coat a silicon wafer. When this polymer is heated, it morphs into a sort of mesh of copper wiring that incorporates not only the solidity needed to run functions but also the literal space needed to facilitate a free flow of electrical power.


It's all done on a really small microprocessor just 20 nanometers across. The number of microscopic holes is in the trillions, and the possibilities for application seem to be plentiful as well.

IBM says the chips will be able to process information at a rate that is a full 33 percent faster than current top speeds but won't require a corresponding power drain.

Nature comes in in the form of snowflakes and seashells, which showcase a similar process.




Written by Monica Tele
Published in Technology News